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Rogers-TMM13i-High-Frequency-PCB-15mil-20mil-25mil-60mil-RF-PCB-for-Stripline-and- Microstrip-Application |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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General Description |
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Rogers TMM13i thermoset microwave laminates are ceramic-hydrocarbon thermoset polymer composites engineered specifically for stripline and microstrip applications that demand high PTH (plated-through-hole) reliability. With a dielectric constant of 12.85 and a dissipation factor of 0.0019, these laminates offer excellent electrical performance.
One of the key features of Rogers TMM13i PCB is its extremely low thermal coefficient of dielectric constant. The material's isotropic coefficients of thermal expansion closely match those of copper. This compatibility significantly enhances the reliability of plated-through holes during manufacturing and reduces etch shrinkage, ensuring precise circuit patterns. Additionally, TMM13i laminate has a thermal conductivity approximately double that of traditional PTFE/ceramic laminates, enabling efficient heat dissipation and better thermal management.
As TMM13i PCB consists of thermoset resins, it maintains its structural integrity even when exposed to high temperatures, as it does not soften upon heating. This characteristic allows for seamless wire bonding of component leads to circuit traces, eliminating concerns about pad lifting or substrate deformation and enabling robust electronic assembly processes. |
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Typical Applications |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our PCB Capability(TMM13i) |
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PCB Capability (TMM13i) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM13i |
Dielectric constant: |
12.85±0.35 |
Layer count: |
Single Layer,Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, ENEPIG, Pure gold etc.. |
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Why Choose Us? |
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1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3 |
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Typical Value of TMM13i |
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TMM13i Typical Value |
Property |
TMM13i |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
12.85±0.35 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
12.2 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.0019 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
-70 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
- |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
- |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
213 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
19 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
19 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
- |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
4.0 (0.7) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
- |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
- |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.16 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.13 |
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Specific Gravity |
3 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
- |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
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Hot Tags:
Rogers TMM 13i PCB |
TMM 13i High Frequency PCB |
TMM 13i RF PCB |
TMM 13i DK 12.85 PCB |
Rogers TMM 13i ENIG PCB |
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